Direct digital manufacturing of mm-wave vertical interconnects
Direct digital manufacturing of mm-wave vertical interconnects
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毫米波垂直互连的直接数字化制造
DOI：
10.1109/wamicon.2018.8363917
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
Weller, Thomas M.
中科院分区：
文献类型：
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作者：
Rojas-Nastrucci, Eduardo A.;Ramirez, Ramiro A.;Weller, Thomas M.
增材制造 (AM) 越来越多地被证明是一种用于制造复杂 3D 结构的可行技术。对于微波元件，据报道，激光加工和增材制造技术的结合可以提高设备的性能和频率限制。本文研究了一种结合熔融沉积建模 (FDM)、微点胶和皮秒激光加工的 200 μm × 200 μm × 200 μm 垂直互连的制造工艺。设计、制造和测试了包括两个垂直过渡的测试结构，作为性能基准。 4 毫米长的结构具有低耗散损耗（45 GHz 时为 2.5 dB）以及高达毫米波频率的出色频率响应。所描述的结构将有助于实现高性能结构射频电子器件的制造。
Additive manufacturing (AM) is increasingly being shown as a viable technology for the fabrication of complex 3D structures. For microwave components, the combination of laser processing and AM techniques has been reported to enhance the performance and frequency limits of the devices. In this paper, a process to fabricate a 200 μm × 200 μm × 200 μm vertical interconnect that combines fused deposition modeling (FDM), micro-dispensing, and picosecond laser machining is studied. A test structure that includes two vertical transitions is designed, fabricated, and tested, as a performance benchmark. The 4 mm long structure shows a low dissipative loss (2.5 dB at 45 GHz) and excellent frequency response up to mm-wave frequencies. The described structure will help to enable the fabrication of high-performance structural RF electronics.