Statistical Characterization of Fracture Strength and Fatigue Lifetime of Polysilicon Thin Films with Different Stress Concentration Fields
Statistical Characterization of Fracture Strength and Fatigue Lifetime of Polysilicon Thin Films with Different Stress Concentration Fields
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DOI：
10.1299/jmmp.6.1013
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
V. Huy;S. Kamiya;J. Gaspar;O. Paul
中科院分区：
文献类型：
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作者：
V. Huy;S. Kamiya;J. Gaspar;O. Paul
本文介绍了用腐蚀法制作的多晶硅薄膜试件的强度分布和疲劳性能的评价。样本的静态强度分布通过应用于沿着蚀刻表面的局部点的双参数威布尔分布来描述。疲劳寿命也局部地表示为裂纹扩展过程，从代表蚀刻损伤的初始裂纹开始，从而通过应用众所周知的巴黎定律确定强度分布。将Weibull分布和巴黎定律中的参数与相同条件下制备的三种不同形状的试件的拉伸静强度和疲劳试验结果进行了拟合。使用推断统计分析参数分布范围。结果表明，尽管试样的应力分布不同，但试样的断裂和疲劳行为可以用一组唯一的参数来描述。这意味着腐蚀损伤的局部特征和随后的疲劳载荷下的损伤累积是独立的形状，从而试样的应力分布。
This paper presents an evaluation of strength distribution and fatigue behavior of polycrystalline silicon thin film specimens patterned by etching into arbitrary shapes. The static strength distribution of specimens is described by a two-parameter Weibull distribution applied to local points along the etched surface. The fatigue lifetime is formulated also locally as a crack extension process, starting from initial cracks which represent the etching damage and thus determine the strength distribution, by applying the well-known Paris law. The parameters in the Weibull distribution and in Paris’ law were fit to the results of tensile static strength and fatigue tests performed on the specimens with three different shapes fabricated under the same conditions. Parameter distribution ranges were analyzed using inferential statistics. It was found that the fracture and fatigue behaviors of the specimens can be described by using a unique set of parameters despite the different stress distribution. This means that the local characteristics of etching damage and subsequent damage accumulation under fatigue loading was independent of the shapes and thus of the stress distributions of specimens.