Effect of Grinding Method on Bending Strength of Silicon Nitride.
Effect of Grinding Method on Bending Strength of Silicon Nitride.
复制标题
磨削方法对氮化硅抗弯强度的影响。
DOI：
10.1299/jsmea.42.560
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发表时间：
1999
期刊：
影响因子：
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通讯作者：
Keisuke Tanaka
中科院分区：
文献类型：
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作者：
Y. Sakaida;Keisuke Tanaka
氮化硅弯曲试样的表面加工采用表面磨削法或面磨削法。研磨采用砂度为200/230 #的盘形或杯形金刚石砂轮。砂轮的进给方向与弯曲试样的纵向平行或垂直。通过弯曲强度和磨削表面残余应力分布估计磨削缺陷的大小。表面磨削时，平行于进给方向形成的磨削缺陷深度为40 ~ 70 μm；这种磨削缺陷延伸到压残余应力区之外，因此应力屏蔽作用较小。较大的裂纹尺寸降低了断裂强度。而面磨试样的缺陷深度在10 ~ 30 μm之间。由于裂纹位于压缩区，磨削后试样的断裂强度高于研磨后试样的断裂强度。由于面磨后不需要进行更精细的精加工，因此建议采用面磨方法以减少加工成本。
The surface of bending specimens of silicon nitride is finished by the surface-grinding method or the face-grinding method. A disk-shaped or cup-shaped diamond wheel with the grit size of #200/230 is used for grinding. The feed direction of the grinding wheel is either parallel or perpendicular to the longitudinal direction of bending specimens. The grinding flaw size is estimated from the bending strength and the residual stress distribution near the ground surface. In the case of surfece-grinding, the depth of grinding flaws formed parallel to the feed direction ranges from 40 to 70 μm. This grinding flaw extends outside the compressive residual stress zone, so the stress shielding effect is small. The large flaw size reduces the fracture strength. On the other hand, the depth of flaws of face-ground specimens ranges from 10 to 30 μm. The fracture strength after face-grinding is higher than that of lapped specimens because the flaw lies in the compression zone. The face-grinding method is recommended to minimize machining costs because finer finishing is unnecessary after facegrinding.