Influence of indium addition on characteristics of Sn-03Ag-0.7Cu solder alloy
Influence of indium addition on characteristics of Sn-03Ag-0.7Cu solder alloy
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DOI：
10.1016/j.jallcom.2009.06.020
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发表时间：
2009-10-19
影响因子：
6.2
通讯作者：
Ariga, Tadashi
中科院分区：
文献类型：
--
作者：
Kanlayasiri, Kannachai;Mongkolwongrojn, Mongkol;Ariga, Tadashi
本文研究了铟 (In) 添加量对 Sn-03Ag-0.7Cu 无铅焊料合金的固相线和液相线温度、润湿时间、润湿力、拉伸强度和显微硬度的影响。铟的添加量在 0 至 3 wt% 之间变化。研究发现，随着In含量的增加，焊料合金的固相线和液相线温度降低。然而。它还增加了固相线和液相线温度之间的熔化范围。 In的添加减少了焊料合金的润湿时间，而润湿力随着In含量的增加而增加。随着In的添加，富Sn相尺寸更小，金属间化合物分布更均匀。当焊料合金中添加In时，Sn-0.3Ag-0.7Cu的抗拉强度和显微硬度得到提高。 (C) 2009 Elsevier B.V. 保留所有权利
Effects of indium (In) addition on solidus and liquidus temperatures, wetting time, wetting force, tensile strength, and microhardness of Sn-03Ag-0.7Cu lead-free solder alloy were investigated in this paper Indium was added and varied from 0 to 3 wt%. It is found that solidus and liquidus temperatures of the solder alloy are lowered as the In content is increased. However. In also increases the melting range between solidus and liquidus temperatures. Wetting time of the solder alloy is reduced by the addition of In while the wetting force is increased with the increase of In content. With the addition of In, the Sn-rich phase is smaller in size, and the intermetallic compounds are more uniformly distributed As a result. tensile strength and microhardness of Sn-0.3Ag-0.7Cu are increased when In is added into the solder alloy. (C) 2009 Elsevier B.V. All rights reserved