Nanoscale transfer printing for heterogeneous device integration (Conference Presentation)
Nanoscale transfer printing for heterogeneous device integration (Conference Presentation)
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用于异构设备集成的纳米级转移打印（会议演示）
DOI：
10.1117/12.2254260
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发表时间：
2017
期刊：
影响因子：
--
通讯作者：
Hurtado A
中科院分区：
文献类型：
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作者：
Hurtado A
我们提出了一种新颖的纳米级转移印刷（TP）技术，该技术将定制的纳米光刻系统与定制的弹性体μ-印模相结合，以可控地拾取和放置各种半导体结构，例如纳米线（NW）、发光二极管（LED）和薄膜，到异质材料表面（例如聚合物、金属、二氧化硅、金刚石）上的目标位置上。值得注意的是，我们的技术允许将不同材料的半导体结构并行印刷到大面积（10 cm x 10 cm）上，同时产生亚微米定位控制（低至100 nm以下）和低印刷时间（每个印刷步骤约20 s）。在演讲中，我们将介绍各种混合集成器件与我们的TP技术制造。重点将放在我们最近使用氮化镓（GaN）LED和磷化铟（InP）NW激光器作为构建模块的工作上。使用TP协议，GaN LED制造的GaN硅基GaN已集成到聚合物和薄玻璃表面和金刚石衬底上的机械灵活的光电器件和有效的设备热管理。此外，超小型InP NW激光器（长约5μm，直径约500 nm）已集成到多个异质衬底上，包括机械柔性（聚合物），透明（二氧化硅）和金属（金）表面。此外，具有微米尺寸的复杂空间图案已被定义为这些纳米激光器作为局部发射器。最后，我们还将介绍我们最近的结果，展示了InP NW激光器与平面波导技术的耦合作为后端混合集成技术。
We present a novel nanoscale transfer printing (TP) technology which combines a customized nanolithography system with bespoke elastomeric μ-stamps to controllably pick and place diverse semiconductor structures, e.g. nanowires (NWs), Light Emitting Diodes (LEDs) and thin films, onto targeted locations on heterogeneous material surfaces (e.g. polymers, metals, silica, diamond). Notably, our technique allows the parallel printing of semiconductor structures of different materials onto a large area (of 10cm x 10cm) whilst simultaneously yielding sub-micrometric positioning control (down to below 100nm) and low printing time (~20s per print step). In the talk, we will present a variety of hybrid integrated devices fabricated with our TP technique. Emphasis will be given to our recent work using Gallium Nitride (GaN) LEDs and Indium Phosphide (InP) NW lasers as building blocks. Using TP protocols, GaN LEDs fabricated from GaN-on-Si have been integrated onto polymer and thin glass surfaces and onto diamond substrates for mechanically flexible optoelectronic devices and effective device heat management respectively. Additionally, ultra-small InP NW lasers (~5μm long and ~500nm diameter) have been integrated onto multiple heterogeneous substrates, including mechanically flexible (polymers), transparent (silica) and metallic (gold) surfaces. Furthermore, complex spatial patterns with micrometric dimensions have been defined with these nanolasers acting as localised emitters. Finally, we will also introduce our very recent results demonstrating the coupling of InP NW lasers with planar waveguide technology as a back-end hybrid integration technique.