Molecular dynamics simulation of the role of dislocations in microcrack healing
Molecular dynamics simulation of the role of dislocations in microcrack healing
复制标题
位错在微裂纹愈合中作用的分子动力学模拟
DOI：
10.1007/bf02487689
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发表时间：
2000-08
期刊：
影响因子：
--
通讯作者：
褚武场
中科院分区：
文献类型：
--
作者：
李深;高克玮;乔利杰;褚武场
The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress. A centre microcrack in Cu crystal would be sealed under compressive stress or by heating. The role of compressive stress and heating in crack healing was additive. During microcrack healing, dislocation generation and motion occurred. When there were pre-existing dislocations around the microcrack, the critical temperature or compressive stress necessary for microcrack healing would decrease, and, the higher the number of dislocations, the lower the critical temperature or compressive stress. The critical temperature necessary for microcrack healing depended upon the orientation of the crack plane. For example, the critical temperature for the crack along the (001) plane was the lowest, i.e. 770K.
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DOI：
10.1016/0956-716x(95)00139-m
发表时间：
1995-07
期刊：
Scripta Metallurgica Et Materialia
影响因子：
--
作者：
Yong-Wei Zhang;Tao Wang;Q. H. Tang
通讯作者：
Yong-Wei Zhang;Tao Wang;Q. H. Tang
影响因子：
3.9
作者：
A. M. Thompson;H. M. Chan;M. Harmer;Robert E. Cook
通讯作者：
A. M. Thompson;H. M. Chan;M. Harmer;Robert E. Cook
DOI：
10.1007/bf02642021
发表时间：
1970-06
期刊：
Metallurgical Transactions
影响因子：
--
作者：
E. Shapiro;G. E. Dieter
通讯作者：
E. Shapiro;G. E. Dieter
DOI：
10.1201/9781439878057
发表时间：
2008-01
期刊：
--
影响因子：
--
作者：
T. Kundu
通讯作者：
T. Kundu
DOI：
10.1016/b978-0-08-042824-6.50087-8
发表时间：
1996
期刊：
Advances in Engineering Plasticity and its Applications
影响因子：
--
作者：
K. Gao;W. Chu;Yanbin Wang;C. Hsiao
通讯作者：
K. Gao;W. Chu;Yanbin Wang;C. Hsiao