A Hybrid Electrode Array With Built-In Position Sensors for an Implantable MEMS-Based Cochlear Prosthesis
A Hybrid Electrode Array With Built-In Position Sensors for an Implantable MEMS-Based Cochlear Prosthesis
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用于基于 MEMS 的植入式人工耳蜗的具有内置位置传感器的混合电极阵列
DOI：
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发表时间：
2008
影响因子：
2.7
通讯作者：
K. Wise
中科院分区：
文献类型：
--
作者：
J. Wang;K. Wise
已经开发了一种混合电极阵列，用于基于MEMS的植入式人工耳蜗，旨在恢复深度耳聋患者的听力。该阵列提供高密度刺激和嵌入式位置传感，以改善声音感知，最大限度地减少插入损伤，并优化种植体放置。该阵列通过8引脚聚合物电缆与密封封装的微控制器和双向无线接口接口连接，将定制信号处理电子器件与薄膜光刻定义的IrO电极和多晶硅位置传感器集成在一起。信号处理芯片（2.4 mm × 2.4 mm）采用plusmn2.5 V工作，接受16-B命令，并执行命令验证、激励电流生成、部位/传感器选择、偏移补偿和输出信号调节。该阵列包含九个多晶硅应变片，用于检测阵列位置和尖端接触。这些应变传感器具有15-20的应变系数，允许在50 μ m内确定阵列尖端位置，同时提供超过100 mV的尖端接触信号。片内信号处理允许使用标准总线接口，降低了连接电缆上的寄生电容和噪声耦合，允许阵列形状以每秒10次的速率成像，并将输出噪声抑制到3 mV。
A hybrid electrode array has been developed for use in an implantable MEMS-based cochlear prosthesis intended to restore hearing to the profoundly deaf. The array provides high-density stimulation and embedded position sensing to improve sound perception, minimize insertion damage, and optimize implant placement. Interfacing with a hermetically-packaged microcontroller and a bidirectional wireless interface over an eight-lead polymeric cable, the array integrates custom signal-processing electronics with thin-film lithographically defined IrO electrodes and polysilicon position sensors. The signal-processing chip (2.4 mm times 2.4 mm) operates from plusmn2.5 V, accepts 16-b commands, and performs command validation, stimulus current generation, site/sensor selection, offset compensation, and output-signal conditioning. The array contains nine polysilicon strain gauges to detect array position and tip contact. These strain sensors have gauge factors of 15-20, allowing the array tip position to be determined within 50 mum while providing tip-contact signals of more than 100 mV. The on-chip signal processing allows the use of a standard bus interface, reduces the parasitic capacitance and noise coupling on the connecting cables, allows the array shape to be imaged at a rate up to 10 times per second, and suppresses the output noise down to 3 mV.
人工耳蜗的过去、现在和未来。
DOI：
10.1109/51.765186
发表时间：
1999
期刊：
IEEE engineering in medicine and biology magazine : the quarterly magazine of the Engineering in Medicine & Biology Society
影响因子：
--
作者：
Spelman,FA
通讯作者：
Spelman,FA