Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
复制标题
服务器散热设计对散热效率的影响:机箱设计
DOI:
10.1115/1.4042983
复制
发表时间:
2019
影响因子:
1.6
通讯作者:
Sammakia, Bahgat
中科院分区:
文献类型:
--
作者:
Khalili, Sadegh;Alissa, Husam;Nemati, Kourosh;Seymour, Mark;Curtis, Robert;Moss, David;Sammakia, Bahgat
There are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency.
DOI:
10.1109/itherm.2018.8419555
发表时间:
2018
期刊:
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
影响因子:
--
作者:
Khalili, Sadegh;Alissa, Husam;Desu, Anuroop;Sammakia, Bahgat;Ghose, Kanad
通讯作者:
Ghose, Kanad
DOI:
10.1109/semi-therm.2017.7896916
发表时间:
2017
期刊:
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
影响因子:
--
作者:
Mohammad I. Tradat;H. Alissa;K. Nemati;Sadegh Khalili;B. Sammakia;M. Seymour;Russell Tipton
通讯作者:
Mohammad I. Tradat;H. Alissa;K. Nemati;Sadegh Khalili;B. Sammakia;M. Seymour;Russell Tipton
影响因子:
1.6
作者:
K. Nemati;H. Alissa;B. Murray;B. Sammakia;M. Seymour
通讯作者:
M. Seymour