In situ measurement method for film thickness using transparency resin sheet with low refractive index under wet condition on chemical mechanical polishing

In situ measurement method for film thickness using transparency resin sheet with low refractive index under wet condition on chemical mechanical polishing
复制标题

化学机械抛光湿法低折射率透明树脂片膜厚原位测量方法

DOI:
--
复制
发表时间:
2017
期刊:
Japanese journal of applied physics (JJAP).
影响因子:
--
通讯作者:
and Keisuke Suzuki
and Keisuke Suzuki
中科院分区:
--
文献类型:
--
作者:
Takahiro Oniki;Panart Khajornrungruang;and Keisuke Suzuki

文献摘要

相似文献