Development of sandwich joining piece to fabricate segmented half-Heusler/skutterudite thermoelectric joints
Development of sandwich joining piece to fabricate segmented half-Heusler/skutterudite thermoelectric joints
复制标题
开发三明治连接件来制造分段半霍斯勒/方钴矿热电接头
DOI:
10.1007/s12598-020-01487-1
复制
发表时间:
2020
期刊:
影响因子:
8.8
通讯作者:
Jin-Hui Fan
中科院分区:
文献类型:
--
作者:
Wei-An Wang;Xiao-Ya Li;Yun-Fei Xing;Ming Gu;Long-Hui Fang;Ye-Feng Bao;Jin-Hui Fan
AbstractSn/Ni–Sn/Sn sandwich joining piece was developed and applied to fabricate segmented half-Heusler/skutterudite thermoelectric joints, and high-temperature service behavior of the joints was studied. The microstructure and contact resistance of the joint before and after aging were investigated. The joints are well bonded and no cracks appear at the interfaces of the joint before and after aging, which can be attributed to the formation of high-melting point intermetallic compounds. The electrical resistance crosses the joining layer smoothly and the contact resistance is low. These results show that the sandwich joining piece is effective and flexible, and promising for the preparation of segmented thermoelectric devices.Graphic abstract