Template-free one-step fabrication of porous CuInS2 hollow microspheres

Template-free one-step fabrication of porous CuInS2 hollow microspheres
复制标题

无模板一步法制备多孔CuInS2空心微球

DOI:
10.1016/j.micromeso.2008.01.027
复制
发表时间:
2008-09
影响因子:
5.2
通讯作者:
Zeng, Suyuan
Zeng, Suyuan
中科院分区:
材料科学2区
文献类型:
--
作者:
Tang, Kaibin;Qi, Yunxia;Zhou, Weiwei;Zeng, Suyuan

文献摘要

参考文献

被引文献

相似文献

采用简单的溶液法在不使用模板剂和表面活性剂的情况下成功制备了CuInS 2空心微球。透射电子显微镜(TEM)图像清楚地显示了所得产物的中空性质。场发射扫描电子显微镜(FESEM)结果表明,所制备的CuInS 2微球的壳层由纳米颗粒或纳米片构成。通过气体吸附测量所获得的产物的比表面积和孔径分布表明,CuInS 2中空微球具有高的Brunauer-Emmett-Teller(BET)比表面积和孔隙率特性。TEM观察不同反应阶段的中间产物表明,这些空心CuInS 2微球主要通过Ostwald熟化形成。
Hollow CuInS2microspheres have been successfully prepared via a simple solution-based route without employing templates and surfactants. Transmission electron microscope (TEM) images clearly show the hollow nature of the as-obtained products. Field emission scanning electron microscopy (FESEM) images reveal that the shells of as-prepared CuInS2microspheres were constructed by nanoparticles or nanoflakes. The specific surface area and pore-size distribution of the obtained product as determined by gas-sorption measurements show that the CuInS2hollow microspheres exhibit high Brunauer–Emmett–Teller (BET) surface area and porosity properties. TEM observations of intermediate products at different reaction stages indicate that these hollow CuInS2microspheres are formed mainly via Ostwald ripening.
DOI: 10.1021/ic9911365
发表时间: 2000-03
影响因子: 4.6
作者:
Q. Lu;J. Hu;K. Tang;Y. Qian;G. Zhou;X. Liu
通讯作者: Q. Lu;J. Hu;K. Tang;Y. Qian;G. Zhou;X. Liu
DOI: 10.1002/(sici)1521-4095(200006)12:11
发表时间: 2000-06
期刊: Advanced Materials
影响因子: 29.4
作者:
Wei Yu;Jian Pei;Weimin Huang;A. Heeger
通讯作者: Wei Yu;Jian Pei;Weimin Huang;A. Heeger
DOI: 10.1021/jp0377782
发表时间: 2004-03-18
影响因子: 3.3
作者:
Yang, HG;Zeng, HC
通讯作者: Zeng, HC
DOI: 10.1021/cm001184j
发表时间: 2001-01
影响因子: 8.6
作者:
Dayang Wang;R. Caruso;F. Caruso
通讯作者: Dayang Wang;R. Caruso;F. Caruso
DOI: 10.1021/cm0518022
发表时间: 2006-07-11
影响因子: 8.6
作者:
Nakamura, Hiroyuki;Kato, Wataru;Maeda, Hideaki
通讯作者: Maeda, Hideaki