Electrophoretic deposition for coatings and free standing objects
Electrophoretic deposition for coatings and free standing objects
复制标题
DOI：
10.1023/b:jmsc.0000012905.62256.39
复制
发表时间：
2004-02-01
影响因子：
4.5
通讯作者：
Vleugels, J
中科院分区：
文献类型：
--
作者：
Van der Biest, O;Put, S;Vleugels, J
对电沉积过程进行了模拟，使人们能够预测不同电学性质的液体和所用粉末的沉积产率随时间的变化。结果表明，在采取特殊预防措施的情况下，可以确定沉积层的阻力限制其厚度的条件。然而，在大多数情况下，特别是在使用具有合理导电性的液体的情况下，沉积物的电阻不应限制其增长。文中还讨论了在自由放置物体成形中的其他重要问题，特别是电极形状和电场分布、沉积物与电极的分离和物体的干燥。(C)2004年克鲁沃学术出版社。
A simulation of the electrophoretic deposition process is presented, which allows one to predict the yield of deposition as a function of time for different values of the electrical properties of the liquid and the powders used. It is shown that with special precautions, conditions can be defined where the resistance of the deposit will limit its thickness. Under most conditions however, particularly if a liquid with reasonable electrical conductivity is used, the resistance of the deposit should not limit its growth. Other issues which are of importance in the shaping of free standing objects are also discussed, in particular the electrode shape and electric field distribution, separation of the deposit from the electrode and drying of the object. (C) 2004 Kluwer Academic Publishers.