Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

Advanced electrical array interconnections for ultrasound probes integrated in surgical needles
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用于集成在手术针中的超声探头的先进电气阵列互连

DOI:
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发表时间:
2014
期刊:
Electronic Packaging Technology Conference
影响因子:
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通讯作者:
M. Desmulliez
M. Desmulliez
中科院分区:
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文献类型:
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作者:
Giuseppe Schiavone;Thomas Jones;D. Price;R. McPhillips;Z. Qiu;C. Démoré;Yun Jiang;C. Meggs;S. Mahboob;S. Eljamel;T. Button;S. Cochran;M. Desmulliez

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神经外科手术中的实时超声引导是一种新颖而受欢迎的技术,它可以在手术干预期间以更高的精度获得成像数据。手术针头插入感兴趣的组织,可以使用由嵌入式超声换能器收集的实时图形信息进行引导。现代制造技术的小型化能力使超声探头的制造足够小,可以安装在传统外科手术中使用的针头中(内径小于2毫米)。事实上,高横向分辨率可以通过生产具有一系列发射/接收元件的小型化超声换能器阵列来实现,每个元件都是电隔离的。为了保证这些设备的功能,必须实现一系列独立的电气互连,使成像系统的外部驱动电子设备连接到小型化的超声探头阵列。本文提出了一种新型的连接方案,将集成在手术针中的超声探头与驱动电子器件连接起来。提出的解决方案利用柔性印刷电路板携带电轨道和各向异性导电浆料的粘接技术。
Real-time ultrasound guidance during neurosurgery is a novel and sought-after technique that enables imaging data to be acquired with improved precision during surgical intervention. Surgical needles that are inserted in the tissue of interest can be guided using the real-time graphical information collected by an embedded ultrasound transducer. The miniaturisation capabilities of modern manufacturing technologies allow the fabrication of ultrasound probes that are small enough to be fitted in needles conventionally used in surgical practices (down to ~2 mm inner diameter). High lateral resolution may in fact be achieved by producing miniaturised ultrasound transducer arrays with a series of emitting/receiving elements, each electrically isolated from the others. To guarantee the functionality of such devices, a series of independent electrical interconnections must be implemented that enables the external driving electronics of the imaging system to be connected to the miniaturised ultrasound probe array. This paper presents a novel interconnection scheme designed to interface ultrasound probes integrated in surgical needles with the driving electronics. The presented solution utilises a flexible printed circuit board carrying the electrical tracks and a bonding technique with an anisotropic conductive paste.