Thermal expansion at elevated temperatures. I. Apparatus for use in the temperature range 300-800 K: the thermal expansion of copper
Thermal expansion at elevated temperatures. I. Apparatus for use in the temperature range 300-800 K: the thermal expansion of copper
复制标题
高温下的热膨胀。
DOI：
10.1088/0022-3735/6/1/030
复制
发表时间：
1973
期刊：
影响因子：
--
通讯作者：
B. Yates
中科院分区：
文献类型：
--
作者：
A. F. Pojur;B. Yates
给出了一些最近的铜膨胀数据的总结，从中可以明显看出，尽管各个实验室已经建立了实验系统，其产生的结果大部分在低于环境温度约 3% 的范围内，但在高温下的结果差异远不止于此。描述了一个实验性 Fizeau 系统，该系统产生的结果高于环境温度，与国家标准局最近报告的结果一致在大约 2% 范围内。
A summary of some of the more recent dilatometric data for copper is given, from which it is apparent that although experimental systems have been established in various laboratories which yield results agreeing for the most part to within approximately 3% below ambient temperature, results at elevated temperatures differ by considerably more than this. An experimental Fizeau system is described which has yielded results above ambient temperature agreeing within approximately 2% with results reported recently from the National Bureau of Standards.