Development of a Real-Time Monitoring Method of Electroplating Current Densities in LSI Fabrication by Inverse Analysis of Electric Potentials
Development of a Real-Time Monitoring Method of Electroplating Current Densities in LSI Fabrication by Inverse Analysis of Electric Potentials
复制标题
通过电势逆分析开发大规模集成电路制造中电镀电流密度的实时监测方法
DOI：
--
复制
发表时间：
2009
期刊：
影响因子：
--
通讯作者：
K.Amaya
中科院分区：
文献类型：
--
作者：
Y.Kishimoto;K.Amaya
