Fully-printed, all-polymer, bendable and highly transparent complementary logic circuits
Fully-printed, all-polymer, bendable and highly transparent complementary logic circuits
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DOI：
10.1016/j.orgel.2015.02.006
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发表时间：
2015-05-01
影响因子：
3.2
通讯作者：
Caironi, Mario
中科院分区：
文献类型：
--
作者：
Mandal, Saumen;Dell'Erba, Giorgio;Caironi, Mario
在这项贡献中，我们展示了一种在低温和环境条件下在塑料上印刷制造全聚合物基互补逻辑电路的简单方法。这是通过图形化实现的，采用自下而上的方法，完全合成碳基材料，因此结合了地球丰富的元素，并使回收成为可能——这是低成本一次性电子产品的关键方面。虽然非常简单，但该方法可以将逻辑级的延迟降低到30 μ s，这是迄今为止报道的全聚合物电路中最短的延迟，其中每个单独的组件都已打印出来。此外，我们的电路结合了可弯曲性和高透明度，有利于在便携式和可穿戴大面积电子产品的几个创新应用中采用。(C) 2015 Elsevier B.V.版权所有
In this contribution we show a simple approach for the development of all-polymer based complementary logic circuits fabricated by printing on plastic, at low temperature and in ambient conditions. This is achieved by patterning, with a bottom-up approach, solely synthetic carbon-based materials, thus incorporating earth-abundant elements and enabling in perspective the recycling - a critical aspect for low-cost, disposable electronics. Though very simple, the approach leads to logic stages with a delay down to 30 mu s, the shortest reported to date for all-polymer circuits, where each single component has been printed. Moreover, our circuits combine bendability and high transparency, favoring the adoption in several innovative applications for portable and wearable large-area electronics. (C) 2015 Elsevier B.V. All rights reserved.