Metrology and instrumentation challenges with high-rate, roll-to-roll manufacturing of flexible electronic systems
Metrology and instrumentation challenges with high-rate, roll-to-roll manufacturing of flexible electronic systems
复制标题
柔性电子系统的高速卷对卷制造给计量和仪器带来挑战
DOI：
10.1117/12.940778
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发表时间：
2012
影响因子：
3.6
通讯作者：
Ray T. Chen
中科院分区：
文献类型：
--
作者：
H. Subbaraman;Xiaohui Lin;Xiaochuan Xu;A. Dodabalapur;L. Guo;Ray T. Chen
在这篇文章中，我们讨论了为了实现柔性电子系统卷到卷制造的真正实施，需要克服的计量和仪器挑战。为了实现成功的制造工艺，需要解决和克服涉及的几个计量和仪器挑战，如无微粒高质量衬底的可用性，开发和实施高速在线和离线检测和诊断工具，以及对图案化和非图案化材料薄膜进行自适应控制，开发可靠的硬件等。由于与印刷媒体相比分辨率要求极高，因此还需要仔细确定软件和硬件工具对吞吐量的负担。此外，在系统的硬件和软件设计中，需要准确地确定网络漂移和网络速度变化的影响。通过克服为柔性电子系统开发卷到卷制造系统的挑战，实现成功的计量和仪器测量，为在通信、传感、医学、农业、能源、照明等各种应用中部署高性能柔性电子元件开辟了无限的可能性。
In this paper, we discuss the metrology and instrumentation challenges that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible electronic systems. Several metrology and instrumentation challenges involved such as availability of particulate-free high quality substrate, development and implementation of high-speed in-line and off-line inspection and diagnostic tools with adaptive control for patterned and unpatterned material films, development of reliable hardware, etc need to be addressed and overcome in order to realize a successful manufacturing process. Due to extreme resolution requirements compared to print media, the burden of software and hardware tools on the throughput also needs to be carefully determined. Moreover, the effect of web wander and variations in web speed need to accurately be determined in the design of the system hardware and software. Realization of successful metrology and instrumentation by overcoming the challenges for the development of a roll-to-roll manufacturing system for flexible electronic systems opens limitless possibilities for the deployment of high performance flexible electronic components in a variety of applications including communication, sensing, medicine, agriculture, energy, lighting etc.