A Preliminary Study of the Use of Kynar® Piezoelectric Film to Measure Peel Stresses in Adhesive Joints
A Preliminary Study of the Use of Kynar® Piezoelectric Film to Measure Peel Stresses in Adhesive Joints
复制标题
使用 Kynar® 压电薄膜测量粘合接头剥离应力的初步研究
DOI：
10.1080/00218468908026490
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发表时间：
1989
期刊：
影响因子：
--
通讯作者：
D. Davis
中科院分区：
文献类型：
--
作者：
D. Dillard;G. L. Anderson;D. Davis
摘要为了测试接头内原位粘结的胶粘剂的性能，已经开发了多种测试技术。这些技术中的大多数测量粘结接头的强度、断裂韧性或粘结模量。在粘接接头中测量实际应力或应变值的技术在数量上相当少。Krieger应变计1能够测量沿着12.5 mm标距的厚被粘物接头的平均剪切位移。它主要用于测量粘合剂的原位剪切模量。Brinson和他的同事2建议在粘合剂接头内使用粘合应变计来测量粘合剂内的应变。不幸的是，这些应变计只对横向应变敏感，而对剪切应变或剥离应变不敏感。由于侧向应变主要由被粘物的行为而不是胶粘剂的行为决定，因此所获得的信息是不完整的。
Abstract A variety of test techniques have been developed to test the performance of adhesives bonded in situ within joints. Most of these techniques measure strength, fracture toughness, or adhesive modulus of the bonded joint. Techniques to measure actual stress or strain values within a bonded joint are quite few in number. The Krieger gage1 is able to measure the average shear displacement along a 12.5 mm. gage length of a thick adherend joint. It has been used primarily to measure in situ shear moduli of adhesives. Brinson and his colleagues2 proposed bonding strain gages within adhesive joints to measure strains within the adhesive. Unfortunately, these gages are only sensitive to the lateral strains and not shear or peel strains. Because the lateral strains are dominated by the behavior of the adherends rather than the adhesive, the information which can be gained is incomplete.