Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper
Investigations of effects of bias polarization and chemical parameters on morphology and filling capability of 130 nm damascene electroplated copper
复制标题
偏压极化和化学参数对130 nm镶嵌电镀铜形貌和填充能力影响的研究
DOI：
10.1116/1.1368673
复制
发表时间：
2001
影响因子：
1.4
通讯作者：
C. Lu
中科院分区：
文献类型：
--
作者：
Shih;J. Shieh;K. Lin;B. Dai;Ting;Chia;M. Feng;Ying;C. Lu
通过阐明电流密度、铜离子浓度、镀液温度和空气搅拌对镀铜均匀性和填充能力的影响，说明在酸性铜电解液中，铜的沉积可以缩小到0.13 μm以下的均匀镀层，这是目前化学机械抛光技术所要求的。为实现0.13 μm以下过孔和沟槽的无缺陷填充，电解液必须由适量的铜离子、硫酸、氯离子、润湿剂和填充促进剂组成。将供电电流控制在较低的电流密度下，电镀过程中加入搅拌是进一步的关键。在电解液中，填充促进剂主要由含有苯基和氨基（- NH2）的噻唑衍生物组成，具有充分的铜沉积抑制作用和选择性抑制梯度。此外，低电阻率薄膜和高…
Through elucidating the effects of current density, cupric ion concentration, bath temperature, and air agitation on plating uniformity and filling capability of copper electroplating, the deposition of copper in an acid copper electrolyte will be illustrated to scale down to the sub-0.13 μm features with uniform plating, which is required by chemical mechanical polishing in current damascene techniques. In order to achieve the defect-free filling in sub-0.13 μm vias and trenches, the electrolyte must be composed of proper amounts of cupric ions, sulfuric acid, chloride ions, wetting agent, and filling promoter. The supplied current controlled at a lower current density, agitation acceded to the electroplating process were found as further keys. In the electrolyte, the filling promoter was consisted essentially of thiazole derivatives with benzyl groups and amino-group (−NH2) offering sufficient inhibition on copper depositing and selective inhibition gradient. Moreover, a lower resistivity film and highe...