Loop heat pipe for cooling of high-power electronic components
Loop heat pipe for cooling of high-power electronic components
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DOI：
10.1016/j.ijheatmasstransfer.2008.06.016
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发表时间：
2009-01-15
影响因子：
5.2
通讯作者：
Romanenkov, Vladimir
中科院分区：
文献类型：
--
作者：
Vasiliev, Leonid;Lossouarn, David;Romanenkov, Vladimir
介绍了回路热管技术在大功率IGBT元件冷却系统中的应用。提出了一种先进的LHP蒸发芯制造方法。根据这种方法，设计并制造了外径16 mm、长度280 mm的LHP蒸发器。镍和钛颗粒被用作LHP蒸发器芯制造中的原材料。通过对一个大功率电子模块的冷却，设计了一种额定功率为900 W的LHP，在100 T以下的温度水平和1.5 in的传热距离下，额定功率为900 W以上。开发了一个实验程序来执行LHP性能测试和监测其可操作性在一段时间内，LHP性能的影响，如蒸发器和冷凝器的温度和LHII在重力场中的方向带来的调查。关于该初始系列测试的结果，发现在热负荷的标称范围内的LHP空间取向对整体LHP功能没有显著影响，而冷凝器温度确实起重要作用，特别是在接近临界的热负荷范围内，开发了蒸发器的2D节点模型，并为LIS提供了对以下建议的确认：当高功率耗散水平可用时，低芯电导率非常适合LHP应用，（c）2008 Elsevier Ltd.保留所有权利。
In this paper, we present a new development of loop heat pipe (LHP) technology in its applications to cooling systems for high-power IGBT elements. An advanced method of LHP evaporator wick manufacturing has been proposed. Following this approach, a 16 mm outer diameter and 280 mm-length LHP evaporator was designed and manufactured. Nickel and titanium particles were used as raw material in LHP evaporator wick fabrication. LHP with a nominal capacity as high as 900 W for steady-state condition and more than 900 W for a periodic mode of operation at a temperature level below 100 T and a heat transfer distance of 1.5 in was designed through the cooling of a high-power electronic module. An experimental program was developed to execute LHP performance tests and monitor its operability over a span of time, An investigation of the effects of LHP performance of parameters Such as evaporator and condenser temperatures and LHII orientation in a gravity field was brought about. As regards the results of this initial series of tests, it was found that LHP spatial orientation within the nominal range of heat loads has no drastic effect on overall LHP functioning, whereas condenser temperature does play an important role, especially in the range of heat load close to critical, A 2D nodal model of the evaporator was developed and provides LIS With confirmation of the suggestion that when high-power dissipation levels are available, low wick conductivity is well adapted for LHP applications, (c) 2008 Elsevier Ltd. All rights reserved.