EMC ’ 09 / Kyoto Equivalent Characteristic Impedance and Propagation Constant for Multi-Layer Via Structures
EMC ’ 09 / Kyoto Equivalent Characteristic Impedance and Propagation Constant for Multi-Layer Via Structures
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多层通孔结构的 EMC’09 / 京都等效特性阻抗和传播常数
DOI：
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发表时间：
2009
期刊：
影响因子：
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通讯作者：
J. Drewniak
中科院分区：
文献类型：
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作者：
Siming Pan;Jun Fan;J. Drewniak
采用等效传输线模型研究了多层印刷电路板（PCB）和封装中的通孔结构。基于通孔电路的物理模型，推导了通孔结构的等效传输线模型的R、L、G、C参数的解析表达式，给出了通孔结构的特性阻抗和传播常数等参数的解析表达式。研究了几何参数对通孔等效特性阻抗的影响。所提出的方法提供了一种直接的方法来设计过孔结构，以获得更好的信号完整性。
Via structures in multi-layer printed circuit boards (PCBs) and packages are studied using an equivalent transmission line model. Thus, transmission line theories, such as characteristic impedance and propagation constant, can be used to characterize the performance of via structures in a signal path. The closed-form expressions of R, L, G, C parameters of the equivalent transmission line model are derived based on a physics-based via circuit model with parallel-plane impedances and via-plate capacitances. Effects of geometrical parameters on via equivalent characteristic impedance are studied in the paper as well. The proposed method provides a straightforward approach to design via structures for better signal integrity.