Mutiple electrode patterning of ionic polymer metal composite actuators
Mutiple electrode patterning of ionic polymer metal composite actuators
复制标题
离子聚合物金属复合材料致动器的多电极图案化
DOI：
10.1117/12.658436
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发表时间：
2006
期刊：
影响因子：
--
通讯作者：
Yeong
中科院分区：
文献类型：
--
作者：
I. Oh;Jin;Yeong
离子聚合物/金属复合材料驱动器具有大变形和仿生运动产生的优点。在本研究中，多电极的高贵图案化方法已被开发用于通过驱动多个电极来实现仿生鱼样运动。铂电极的制备方法很多，包括化学还原法、物理溅射法、电子束沉积法和电镀法。离子聚合物金属复合材料驱动器一般采用化学镀技术制备，但制备时间长，驱动性能重复性差。因此，几种制造方法是新的研究相结合的化学镀，光刻，物理溅射和电镀技术能够精确地图案化和驱动的多个电极。目前的研究结果表明，Nafion聚合物膜和铂电极之间的初始复合材料是非常重要的更好的弯曲性能。因此，混合无电化学还原和溅射或电镀可以是更好的弯曲性能的有希望的候选者，尽管在利用掩模带的无电电镀的制造过程中多个电极的图案化形状可能是粗糙的。然而，溅射和电镀方法与光刻技术可以被纳入MEMS器件的精确设计，而致动性能可能会略有下降。
The ionic polymer metal composite actuators have the best merit for large deformation and bio-mimetic motion generation. In this study, the noble patterning methods of multiple electrodes have been developed for the realization of the bio-mimetic fish-like locomotion by actuating the multiple electrodes. There are so many fabrication methods for patterning and depositing the platinum electrodes including electroless chemical reduction, physical sputtering, e-beam deposition and electroplating. Generally, the ionic-polymer metal composite actuator has been fabricated in electroless plating technique, while it needs very long fabrication time and shows poor repeatability in the actuation performance. Therefore the several fabricating methods are newly investigated by combining electroless plating, photolithograpy, physical sputtering, and electroplating techniques capable of precisely patterning and actuating of the multiple electrodes. Present results show that the initial composite between the Nafion polymer membrane and the platinum electrode is very important for the better bending performance. Consequently, the mixing the electroless chemical reduction and sputtering or electroplating can be a promising candidate for the better bending performance, although the patterned shape of the multiple electrodes may be coarse in the fabricating process of the electroless plating with masking tapes. However, the sputtering and electroplating methods with a photolithography technique can be incorporated in the precise design of MEMS devices, while the actuation performance may be slightly reduced.