The Synthesis of Cu-Ag core-shell bimetallic nanoparticles for IC bonding
The Synthesis of Cu-Ag core-shell bimetallic nanoparticles for IC bonding
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DOI：
10.1109/icept.2016.7583248
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发表时间：
2016-08
期刊：
影响因子：
--
通讯作者：
J. Wen;Yanhong Tian
中科院分区：
文献类型：
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作者：
J. Wen;Yanhong Tian
本文介绍了一种用于IC键合的铜银核-壳纳米粒子的合成方法。采用两步法制备了直径均匀、分散性较好的铜银核壳纳米粒子，银纳米粒子紧密分布在铜核上。采用葡萄糖预还原硫酸铜溶液，再用水合肼还原的两步还原工艺是控制纳米颗粒粒径的关键。通过扫描电子显微镜、透射电子显微镜、X射线衍射仪和X射线光电子能谱对核壳结构进行了表征。采用差示扫描量热法对其热性能进行了分析。通过控制时间、温度和浓度两步法制备的铜银核壳纳米粒子，通过改变镀银工艺参数，在电子显微镜下呈现出有趣的烧结现象。
This paper describes a method to synthesize copper-silver core-shell nanoparticles (Cu@Ag NPs) for IC bonding. This kind of copper-silver core-shell nanoparticles was prepared using two-step method with homogeneous diameter, relatively good dispersity and close-grained silver nanoparticles dotting on the copper core. The two-step reduction process, glucose pre-reducing cupric sulfate solution and then hydrazine hydrate reducing it, is the key to controlling the diameter of nanoparticles. The core-shell structure was confirmed through characterization of scanning electron microscope, transmission electron microscope, X-ray diffraction and X-ray photoelectron spectroscopy. Differential scanning calorimetry was used to analyze its thermal properties. The copper-silver core-shell nanoparticles, prepared by controlling time, temperature and concentration of the two-step method and changing the parameters of plating silver, display an amusing phenomenon of sintering under the electron beams of transmission electron microscope.