Strategies for functionally graded lattice structures derived using topology optimisation for Additive Manufacturing

Strategies for functionally graded lattice structures derived using topology optimisation for Additive Manufacturing
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DOI:
10.1016/j.addma.2017.11.008
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发表时间:
2018-01-01
影响因子:
11
通讯作者:
Ashcroft, Ian
Ashcroft, Ian
中科院分区:
工程技术1区
文献类型:
--
作者:
Panesar, Ajit;Abdi, Meisam;Ashcroft, Ian

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提出了许多能够从适合增材制造 (AM) 的拓扑优化 (TO) 结果导出晶格结构的策略。对所提出的策略进行了机械性能评估,并针对增材制造特定设计相关的制造考虑因素进行了评估。从制造的角度来看,支撑结构的要求随着网格化程度的增加而减少,而设计与制造的差异和处理工作(无论是在内存要求还是时间方面)都会增加。针对所考虑的两种负载场景(预期负载和负载变化)的有限元 (FE) 分析结果,可以深入了解解决方案的最优性和设计策略的稳健性。人们发现,与非这种情况的结构相比,利用 TO 结果的晶格策略在比刚度方面要优越得多 (-40-50%)。从设计和制造的角度来看,分级策略被认为是最理想的。所提出的各种设计策略的优缺点旨在深入了解它们在应对增材制造设计界所面临的挑战方面的适用性。 (C) 2017 年作者。由 Elsevier B.V. 出版
A number of strategies that enable lattice structures to be derived from Topology Optimisation (TO) results suitable for Additive Manufacturing (AM) are presented. The proposed strategies are evaluated for mechanical performance and assessed for AM specific design related manufacturing considerations. From a manufacturing stand-point, support structure requirement decreases with increased extent of latticing, whereas the design-to-manufacture discrepancies and the processing efforts, both in terms of memory requirements and time, increase. Results from Finite Element (FE) analysis for the two loading scenarios considered: intended loading, and variability in loading, provide insight into the solution optimality and robustness of the design strategies. Lattice strategies that capitalised on TO results were found to be considerably (-40-50%) superior in terms of specific stiffness when compared to the structures where this was not the case. The Graded strategy was found to be the most desirable from both the design and manufacturing perspective. The presented pros-and-cons for the various proposed design strategies aim to provide insight into their suitability in meeting the challenges faced by the AM design community. (C) 2017 The Authors. Published by Elsevier B.V.