Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing
Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing
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DOI：
10.1016/j.apsusc.2010.06.077
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发表时间：
2010-10
影响因子：
6.7
通讯作者：
Yongguang Wang;Yongwu Zhao;W. An;Z. Ni;Jun Wang
中科院分区：
文献类型：
--
作者：
Yongguang Wang;Yongwu Zhao;W. An;Z. Ni;Jun Wang
基于分子尺度机理、微观接触力学和概率统计理论，建立了化学机械抛光（CMP）中材料去除与磨粒尺寸和浓度的关系模型。首先建立了计算有效颗粒数的封闭式方程。它发现非线性依赖的去除率的颗粒尺寸和浓度，定性与已发表的实验数据。这种非线性关系是磨料粒数、浆料浓度和表面原子结合能与粒度之间的耦合关系造成的。最后，系统参数，如操作条件和材料的属性，以及纳入模型。
A novel material removal model as a function of abrasive particle size and concentration was established in chemical mechanical polishing (CMP) based on molecular scale mechanism, micro-contact mechanics and probability statistics. A close-form equation was firstly developed to calculate the number of effective particles. It found nonlinear dependences of removal rate on the particle size and concentration, being qualitatively agreement with the published experimental data. The nonlinear relation results from the couple relationship among abrasive number, slurry concentration and surface atoms’ binding energy with the particle size. Finally, the system parameters such as the operational conditions and materials properties were incorporated into the model as well.