An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis
An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis
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DOI：
10.1109/tmtt.2010.2052956
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发表时间：
2010-07
影响因子：
4.3
通讯作者：
Yaojiang Zhang;Jun Fan
中科院分区：
文献类型：
--
作者：
Yaojiang Zhang;Jun Fan
采用将板对划分为板区域和过孔区域的分割方法，对具有多个过孔的不规则板对进行了分析。在过孔区域，考虑了所有平行板模式，而在板区域，仅包含传播模式以考虑过孔之间的耦合以及板边缘的反射。在过孔和板边缘都施加了边界条件，并且过孔电路的所有寄生元件都根据平行板模式进行了解析表达。本文所做的工作表明，先前基于直觉的基于物理的过孔电路模型是一种低频近似。通过解析和数值模拟以及测量，对本征过孔电路模型进行了验证。
An irregular plate pair with multiple vias is analyzed by the segmentation method that divides the plate pair into a plate domain and via domains. In the via domains, all the parallel-plate modes are considered, while in the plate domain, only the propagating modes are included to account for the coupling among vias and the reflection from plate edges. Boundary conditions at both vias and plate edges are enforced and all parasitic components of via circuit are expressed analytically in terms of parallel-plate modes. The work presented in this paper indicates that a previous physics-based via circuit model from intuition is a low-frequency approximation. Analytical and numerical simulations, as well as measurements, have been used to validate the intrinsic via circuit model.