The Structure and Micro-Mechanical Properties of Electrodeposited Cobalt Films by Micro-Compression Test

The Structure and Micro-Mechanical Properties of Electrodeposited Cobalt Films by Micro-Compression Test
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DOI:
10.1149/1945-7111/ac2be9
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发表时间:
2021-10
影响因子:
3.9
通讯作者:
Xun Luo;Chun-Yi Chen;T. Chang;M. Sone;Qiong Zhang;Jinzhu Zhang
Xun Luo;Chun-Yi Chen;T. Chang;M. Sone;Qiong Zhang;Jinzhu Zhang
中科院分区:
工程技术4区
文献类型:
--
作者:
Xun Luo;Chun-Yi Chen;T. Chang;M. Sone;Qiong Zhang;Jinzhu Zhang

文献摘要

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采用微压缩试验研究了电沉积钴薄膜在微型磁电子器件中的微力学性能。电沉积的钴具有FCC和HCP晶体结构。在HCP层中也证实了纳米孪晶。由Scherrer方程得到的平均晶粒尺寸为13.8 ~ 15.4nm。微柱的屈服强度范围为948至1075 MPa,约为本体钴的两倍。从微压缩试验中获得的高屈服强度是细晶粒尺寸和小样品尺寸用于压缩试验的结果,这分别对应于Hall-Petch关系和样品尺寸效应。
Micro-mechanical properties of electrodeposited cobalt films were investigated by micro-compression tests for application in miniaturized magnetic electronic devices. FCC and HCP crystal structures were both present in the electrodeposited cobalt. Nanotwins were also confirmed in the HCP lamellas. The average grain size was ranged from 13.8 to 15.4 nm obtained from the Scherrer equation. Yield strengths of the micro-pillars were ranged from 948 to 1075 MPa, which were about twice that of the bulk cobalt. The high yield strength obtained from the micro-compression test was a result of the fine grain size and the small sample size used in the compression test, which correspond well to the Hall-Petch relationship and the sample size effect, respectively.