Structure formation and conductive properties of epoxy/in situ polymerized methacrylate polymer/silver filler composites
Structure formation and conductive properties of epoxy/in situ polymerized methacrylate polymer/silver filler composites
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DOI:
10.1016/j.polymer.2022.124520
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发表时间:
2022-01-10
期刊:
影响因子:
4.6
通讯作者:
Furui, Hirohiko
中科院分区:
文献类型:
--
作者:
Kishi, Hajime;Kimura, Natsumi;Furui, Hirohiko
The structure formation and electrical conductivity of poly[diglycidyl ethers of bisphenol-F (DGEBF)]/poly [dicyclopentenyloxyethyl methacrylate (DPOMA)]/silver (Ag) filler composites were investigated. DGEBF/40 wt % DPOMA blends showed low viscosity and formed co-continuous phase structures at the micrometer scale via in situ radical polymerization of DPOMA followed by anionic polymerization of DGEBF. Scanning electron microscopy and nano-infrared spectroscopy revealed that the Ag fillers, surface-treated with myristic acid, were selectively localized in the methacrylate polymer-rich phases. Consequently, the Ag fillers were present in the self-assembled narrow area, which formed a conductive channel. The DGEBF/DPOMA/Ag composites thus achieved electrical conductivity with a reduction of the 30% Ag fillers, compared to the DGEBF/Ag composites. The mechanism for the selective placement of the Ag fillers was clarified in terms of the affinity among the epoxy-rich phase, the DPOMA polymer-rich phase, and the surface-treated Ag fillers by measurement of their Hansen solubility parameters (HSPs).