Efficient Catalytic Elimination of CH3SH by a Wet-Piezotronics System over Ag Cluster-Deposited BaTiO3 with Electronic Metal–Support Interaction
Efficient Catalytic Elimination of CH3SH by a Wet-Piezotronics System over Ag Cluster-Deposited BaTiO3 with Electronic Metal–Support Interaction
复制标题
通过银簇沉积 BaTiO3 与电子金属支持相互作用的湿式压电系统高效催化消除 CH3SH
DOI:
10.1021/acsestengg.1c00427
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发表时间:
2022-04
影响因子:
7.1
通讯作者:
Chun He
中科院分区:
文献类型:
--
作者:
Jingling Yang;Dingren Ma;Weiqi Liu;Yuhong Liao;Dehua Xia;Chun He
The application of wet-piezotronic catalysis is rarely investigated in eliminating sulfur-containing volatile organic compounds (S-VOCs) in the atmosphere. Herein, Ag clusters deposited on BaTiO3nanorods (NRs) with electronic metal–support interaction (EMSI) were synthesized for the piezocatalytic elimination of a representative S-VOC, CH3SH in a wet scrubbing reactor. The Ag/BaTiO3NRs showed an obvious enhancement of piezocatalytic activity for oxidizing CH3SH to the less-toxic products with a removal rate of 92.0% and a selectivity of 76.7% toward SO42–. The Ag content, piezoelectric potential of the BaTiO3substrate, and wet scrubbing process are confirmed to be vital to the catalytic activity. Based on the experimental analysis and finite element method simulation for BaTiO3, Ag/BaTiO3NRs, and Ag/BaTiO3nanoparticles (NPs), the superior piezocatalytic activity of the Ag/BaTiO3NRs can be attributed to the uniformly dispersed Ag species that enhanced the capture of CH3SH, the larger piezoelectric potential of BaTiO3NRs than that of NPs, the EMSI between Ag and BaTiO3that effectively promoted the migration of piezoelectric electrons, and the enhanced mass diffusion in the wet scrubbing process. Our discovery of the significance of piezoelectric effects in S-VOC removal offers a new option to design high-performance catalysts for VOC purification.
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影响因子:
9.5
作者:
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通讯作者:
Bao, Dinghua
DOI:
10.1002/solr.202000430
发表时间:
2020-09
期刊:
--
影响因子:
--
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4.2
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DOI:
10.1142/9781786341259_0010
发表时间:
2021
期刊:
Catalysis
影响因子:
--
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通讯作者:
S. Ramakrishnan;Ravi Teja A. Tirumala;Farshid Mohammadparast;Tong Mou;Tien Le;Bin Wang;M. Andiappan
影响因子:
19
作者:
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通讯作者:
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