Wafer scale fabrication of highly integrated rubidium vapor cells
Wafer scale fabrication of highly integrated rubidium vapor cells
复制标题
高度集成铷蒸气电池的晶圆级制造
DOI:
10.1109/memsys.2014.6765700
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发表时间:
2014
期刊:
影响因子:
--
通讯作者:
M. Despont
中科院分区:
文献类型:
--
作者:
T. Overstolz;J. Haesler;G. Bergonzi;A. Pezous;Pierre;S. Ischer;J. Kaufmann;M. Despont
This paper reports on wafer scale fabrication of MEMS rubidium (Rb) vapor cells used for spectroscopic measurements in miniaturized atomic clocks. The cell filling process is based on pipetting minute amounts of dissolved rubidium azide (RbN3) into cavities etched in a silicon wafer, hermetic sealing of the cavities by anodic bonding of glass caps, and in situ UV decomposition of the RbN3 into Rb and N2. All relevant elements required for operation such as resistive heaters, temperature sensors, and coils are integrated onto the vapor cell using planar technology. Experiments showed short term frequency stability below 10-10 at 1 second integration time.