Providing a Window into the Phase Behavior of Semiconducting Polymers

Providing a Window into the Phase Behavior of Semiconducting Polymers
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为半导体聚合物的相行为提供了一个窗口

DOI:
10.1021/acs.macromol.1c00296
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发表时间:
2021-06-09
期刊:
影响因子:
5.5
通讯作者:
Stingelin, Natalie
Stingelin, Natalie
中科院分区:
化学1区
文献类型:
--
作者:
Botiz, Ioan;Durbin, Marlow M.;Stingelin, Natalie

文献摘要

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软光子学和电子学的大量功能结构的有针对性的组装依赖于对半导体聚合物相行为的严格理解。虽然在商品塑料领域已经建立了许多有用的关联,但由于这些大分子经常表现出丰富的相行为,部分原因是它们的复杂化学结构通常基于相对刚性的主链和精致的侧链基序,因此为其半导体同行建立统一的理论更具挑战性。因此,固态结构的形成和所产生的性能对加工过程中的热和时间参数特别敏感,使得器件制造成为一项具有挑战性的任务,其过于依赖于耗时的反复试验过程。为了了解塑料半导体凝固的热力学和动力学因素,例如与器件制造相关的薄膜生长,必须获得关于大分子半导体相行为的错综复杂的详细知识,并理想地结合温度/组成、温度/限制和/或时间/温度/转变相图。这将为软电子/光子学系统的受控材料组装开辟道路,非常类似于冶金和无机电子材料领域所使用的方法。反过来,我们设计和处理软电子产品的方式可能会发生阶段性的变化,对更广泛的软物质领域产生影响。
The targeted assembly of a wealth of functional architectures for soft photonics and electronics relies on a rigorous understanding of semiconducting polymer phase behavior. While many useful correlations have been established in the field of commodity plastics, unifying theories for their semiconducting counterparts are, however, more challenging to develop because of the rich phase behavior frequently displayed by these macromolecules, due in part to their complex chemical structures typically based on relatively rigid backbones and elaborate side-chain motifs. Solid-state structure formation and resulting properties are therefore especially sensitive to thermal and temporal parameters during processing, rendering device fabrication a challenging task that too often relies on time-consuming trial-and-error procedures. To understand the thermodynamic and kinetic factors of plastic semiconductor solidification and, for example, thin-film growth relevant for device fabrication, detailed knowledge of the intricacies of macromolecular semiconductors' phase behavior must be gained and ideally combined with temperature/composition, temperature/confinement, and/or time/temperature/transformation- phase diagrams. This will open pathways toward a knowledge and methodology platform for the controlled materials assembly of soft electronics/photonics systems very much in analogy to the approaches used in metallurgy and the inorganic electronic materials field. In turn, a step change in how we design and process soft electronic products might be achieved, with impact on the broader soft matter area.