Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites
Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites
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DOI：
10.1021/cm0527773
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发表时间：
2006-06-27
影响因子：
8.6
通讯作者：
Wong, C. P.
中科院分区：
文献类型：
--
作者：
Jiang, Hongjin;Moon, Kyoung-sik;Wong, C. P.
用二元酸对银纳米粒子进行表面功能化，然后以银片为导电填料将其引入到聚合物基质中。通过使用适当的二元酸，银片和纳米粒子(银片与纳米粒子的摩尔比为6：4)的聚合物复合材料的电阻率大大降低到5×10(-6)欧米茄中心点厘米。形貌研究表明，纳米银颗粒的烧结导致了电阻率的降低。由于银纳米粒子的进一步烧结，聚合物复合材料在85℃和85%相对湿度下的接触电阻随老化时间的延长而显着稳定。
Silver nanoparticles were surface functionalized with diacids and then incorporated into the polymer matrix with silver flakes as conductive fillers. By using appropriate diacids, the resistivity of the silver flakes and nanoparticles (molar ratio of silver flakes to nanoparticles is equal to 6: 4) incorporated polymer composites was dramatically reduced to as low as 5 x 10(-6) Omega center dot cm. Morphology studies showed that the decreased resistivity resulted from the sintering of silver nanoparticles. The contact resistance of the polymer composites under 85 degrees C and 85% relative humidity was significantly stable with respect to aging time as a result of the further sintering of silver nanoparticles.