Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond
Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond
复制标题
100 Gb/s 及以上卡上电气和光学互连的带宽限制比较
DOI：
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发表时间：
2008
期刊：
影响因子：
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通讯作者：
C. Baks
中科院分区：
文献类型：
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作者：
P. Pepeljugoski;M. Ritter;J. Kash;F. Doany;C. Schow;Y. Kwark;L. Shan;D. Kam;X. Gu;C. Baks
服务器和高性能计算中的聚合芯片带宽已经超过Tb/s，如果目前的趋势继续下去，将导致每一代信号引脚的数量增加一倍。对于高带宽交换机和服务器应用，带宽要求可能早在2012年就超过封装引脚限制。我们定义了用于比较电气和光学互连性能的指标，包括带宽密度（Gb/s/mm 2/端口）、介质带宽 * 距离乘积（GHz*m）、功耗（mW/Gb/s/端口）和技术比较指标（Gb/s/mm 2/端口 * GHz*m/mW/端口）。我们将表明，光互连提供了一个性能指标的改善因子大于25电互连。
Aggregate chip bandwidths in server and high performance computing have exceeding Tb/s, and if present trends are to continue would lead to doubling the number of signal pins in each generation. For high bandwidth switch and server applications, bandwidth requirements could exceed the package pin limit as early as 2012. We defined metrics to compare the performance of electrical and optical interconnects, which includes bandwidth density (Gb/s/mm2/port), media bandwidth*distance product (GHz*m), power consumption (mW/Gb/s/Port), and technology comparison metric (Gb/s/mm2/port * GHz*m/mW/Port). We will show that optical interconnects offer a performance metric improvement factor of greater than 25 over electrical interconnects.