Full-wave analysis of packaged microwave circuits with active and nonlinear devices: an FDTD approach
Full-wave analysis of packaged microwave circuits with active and nonlinear devices: an FDTD approach
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DOI：
10.1109/22.575606
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发表时间：
1997-05
影响因子：
4.3
通讯作者：
C. Kuo;B. Houshmand;T. Itoh
中科院分区：
文献类型：
--
作者：
C. Kuo;B. Houshmand;T. Itoh
本文采用扩展时域有限差分法（FDTD）对封装非线性有源微波电路进行了全波分析。基于等效源的方法，器件-波相互作用的特点，并纳入时域有限差分时间推进方案。因此，线性和非线性特性的分析，包括谐波产生和互调，可以通过采用大信号器件电路模型来完成。通过比较无封装结构电路的FDTD和HP MDS仿真结果，验证了该实现方法的有效性。然后，分析超出了电路模拟器的能力，包括封装效应。该分析在涉及电磁兼容/电磁干扰（EMC/EMI）问题的电路设计中是有用的。
This paper presents a comprehensive full-wave analysis of packaged nonlinear active microwave circuits by applying the extended finite-difference time-domain (FDTD) method. Based on the approach of using equivalent sources, the device-wave interaction is characterized and incorporated into the FDTD time-marching scheme. As a consequence, analysis of linear and nonlinear properties, including harmonic generation and intermodulation, can be accomplished by employing a large-signal device circuit model. The implementation is first validated by comparing results of FDTD and HP MDS simulation of the circuit without the packaging structure. The analysis then goes beyond the capability of the circuit simulator to include the packaging effect. This analysis is useful in circuit design involving electromagnetic compatibility/electromagnetic interference (EMC/EMI) problems.