Substrate templating upon self-assembly of hydrogen-bonded molecular networks on an insulating surface.
Substrate templating upon self-assembly of hydrogen-bonded molecular networks on an insulating surface.
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绝缘表面上氢键分子网络自组装的基板模板
DOI:
10.1002/smll.201200681
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发表时间:
2012
期刊:
影响因子:
13.3
通讯作者:
Angelika Kühnle
中科院分区:
文献类型:
--
作者:
Philipp Rahe;Markus Nimmrich;Angelika Kühnle
Molecular self‐assembly on insulating surfaces, despite being highly relvant to many applications, generally suffers from the weak molecule–surface interactions present on dielectric surfaces, especially when benchmarked against metallic substrates. Therefore, to fully exploit the potential of molecular self‐assembly, increasing the influence of the substrate constitutes an essential prerequisite. Upon deposition of terephthalic acid and trimesic acid onto the natural cleavage plane of calcite, extended hydrogen‐bonded networks are formed, which wet the substrate. The observed structural complexity matches the variety realized on metal surfaces. A detailed analysis of the molecular structures observed on calcite reveals a significant influence of the underlying substrate, clearly indicating a substantial templating effect of the surface on the resulting molecular networks. This work demonstrates that choosing suitable molecule/substrate systems allows for tuning the balance between intermolecular and molecule–surface interactions even in the case of typically weakly interacting insulating surfaces. This study, thus, provides a strategy for deliberately exploiting substrate templating to increase the structural variety in molecular self‐assembly on a bulk insulator at room temperature.
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DOI:
--
发表时间:
1969
期刊:
影响因子:
--
作者:
D. Duchamp;R. E. Marsh
通讯作者:
R. E. Marsh
影响因子:
3.9
作者:
J. Schütte;P. Rahe;Lutz Tröger;S. Rode;R. Bechstein;M. Reichling;A. Kühnle
通讯作者:
A. Kühnle
影响因子:
13.3
作者:
Mativetsky, Jeffrey M.;Burke, Sarah A.;Grutter, Peter
通讯作者:
Grutter, Peter
影响因子:
3.7
作者:
Prauzner-Bechcicki, Jakub S.;Godlewski, Szymon;Szymonski, Marek
通讯作者:
Szymonski, Marek
影响因子:
29.4
作者:
Dienel, Thomas;Loppacher, Christian;Fritz, Torsten
通讯作者:
Fritz, Torsten