Selective Metallization of 3D Printable Thermoplastic Polyurethanes
Selective Metallization of 3D Printable Thermoplastic Polyurethanes
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DOI：
10.1109/access.2019.2931594
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发表时间：
2019-01-01
期刊：
影响因子：
3.9
通讯作者：
Marques-Hueso, Jose
中科院分区：
文献类型：
--
作者：
Ryspayeva, Assel;Jones, Thomas David Arthur;Marques-Hueso, Jose
本文介绍了一种新开发的3D打印热塑性聚氨酯弹性体（TPU）的选择性金属化方法：FilaFlex（R）、SemiFlex（TM）、PolyFlex（TM）和NinjaFlex（R）。通过光还原法在TPU表面原位制备了银纳米粒子，并将其作为铜离子吸附的催化剂。该方法证明了在柔性TPU长丝上成功制造铜图案。此外，在同一部件中印刷的PolyflexTM和丙烯腈-丁二烯-苯乙烯（ABS）长丝已被用于直接在PolyflexTM材料上进行选择性无电镀。沉积在Polyflex（TM）上的无电镀铜具有（139.4 +/- 7.2）m Ω/平方的薄层电阻和（1.1 +/- 0.1）× 10（7）S/m的铜电导率，这与块状铜相当。镀铜的Polyflex（TM）互连被制造作为概念演示的证明。
This paper presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex (R), SemiFlex (TM), PolyFlex (TM), and NinjaFlex (R). Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex (TM) and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex (TM) material. Electroless copper deposited onto Polyflex (TM) has a sheet resistance of (139.4 +/- 7.2) m Omega/square and a copper conductivity of (1.1 +/- 0.1) x 10(7) S/m that is comparable with bulk copper. Copper-plated Polyflex (TM) interconnects were fabricated as a proof of concept demonstrators.