Pattern formation of polyimide by using photosensitive polybenzoxazole as a top layer
Pattern formation of polyimide by using photosensitive polybenzoxazole as a top layer
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DOI:
10.1016/j.eurpolymj.2010.04.004
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发表时间:
2010-07
影响因子:
6
通讯作者:
Tomohito Ogura;Tomoya Higashihara;M. Ueda
中科院分区:
文献类型:
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作者:
Tomohito Ogura;Tomoya Higashihara;M. Ueda
A versatile method for positive-type patterning of polyimide (PI) based on a two-layer photosensitive poly(benzoxazole) (PSPBO) and poly(amic acid) (PAA) film has been developed to provide a promising material in the field of microelectronics. This patterning system consisted of a pristine PAA thick bottom-layer and a poly(o-hydroxy amide) (PHA) thin top layer with 9,9-bis[4-(tert-butoxycarbonyl-methyloxy)phenyl]fluorene (TBMPF) as a dissolution inhibitor, and (5-propylsulfonyloxyimino-5H-thiophene-2-ylidene)-(2-methylphenyl)-acetonitrile (PTMA) as a photoacid generator (PAG). The PHA and PAA were prepared from 4,4′-(hexafluoroisopropylidene)-bis(o-aminophenol) and 4,4′-oxybis(benzoic acid) derivatives, and 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 4,4′-oxydianiline, respectively, in N,N-dimethylacetamide. This two-layer system based on PHA (150-nm thickness) and PAA (1.5-μm thickness) showed high sensitivity of 35mJ/cm2and high contrast of 10.3 when exposed to a 365nm line (i-line), post-baked at 100°C for 2min, and developed in a 2.38wt.% tetramethylammonium hydroxide aqueous solution/5wt.% iso-propanol at 25°C. A clear positive image of a 4-μm line-and-space pattern was printed on a film which was exposed to 100mJ/cm2of i-line by a contact-printing mode and fully converted to the corresponding PBO/PI pattern upon heating at 350°C, confirmed by FT-IR spectroscopy. This two-layer system could be applied to the patterning of various PAAs.