Encapsulation of abrasive particles by plasma CVD
Encapsulation of abrasive particles by plasma CVD
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通过等离子体 CVD 封装磨料颗粒
DOI：
10.1016/s0257-8972(03)00200-7
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发表时间：
2003
期刊：
影响因子：
--
通讯作者：
P. Rohr
中科院分区：
文献类型：
--
作者：
M. Karches;M. Morstein;P. Rohr
设计了一种用于高温切削工艺的新型磨料，该磨料通过用惰性金属氧化物膜（氧化铝）包封硬质颗粒（SiC）来结合硬度和化学稳定性。使用循环流化床反应器系统和等离子体化学气相沉积（CVD）技术，涂层非常均匀，并且可以与后续表面处理相结合，以提高对粘合基质的粘附力。1 μm的阻挡层厚度足以在1000 °C下稳定Ni合金基质中的颗粒。在薄膜沉积过程中通过磨损去除部分薄膜会导致边缘处的局部溶解。
A new abrasive material for high-temperature cutting processes has been designed, which combines hardness and chemical stability, by encapsulating hard particles (SiC) with an inert metal oxide film (alumina). Using a circulating fluidised bed reactor system and the plasma chemical vapour deposition (CVD) technique, the coating is very uniform and it can be combined with a subsequent surface treatment for improved adhesion to the bonding matrix. A barrier layer thickness of 1 μm is sufficient to stabilize the particles in a Ni-alloy matrix at 1000 °C. Partial film removal by attrition during the film deposition process causes local dissolution at the edges.