InfraStructs
InfraStructs
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基础设施
DOI：
--
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发表时间：
2013
影响因子：
6.2
通讯作者：
Andrew D. Wilson
中科院分区：
文献类型：
--
作者：
Karl D. D. Willis;Andrew D. Wilson
我们介绍了基于材料的标签，将信息嵌入数字制造的物体中，以便在太赫兹区域成像。太赫兹成像可以安全地穿透许多常见材料，为将隐藏信息编码为制造过程的一部分开辟了新的可能性。我们概述了设计，制造，成像和数据处理步骤，以制造物理对象内部的信息。原型标签设计的位置编码，姿态估计，对象识别，数据存储和认证。我们提供了详细的分析的约束和性能考虑因素设计CNOSTruct标签。未来的应用场景从生产线库存，到定制游戏配件，再到移动的机器人。
We introduce InfraStructs, material-based tags that embed information inside digitally fabricated objects for imaging in the Terahertz region. Terahertz imaging can safely penetrate many common materials, opening up new possibilities for encoding hidden information as part of the fabrication process. We outline the design, fabrication, imaging, and data processing steps to fabricate information inside physical objects. Prototype tag designs are presented for location encoding, pose estimation, object identification, data storage, and authentication. We provide detailed analysis of the constraints and performance considerations for designing InfraStruct tags. Future application scenarios range from production line inventory, to customized game accessories, to mobile robotics.