Surface Texturing of High-Power Flip-Chip LEDs by Femtosecond Laser Direct Structuring
Surface Texturing of High-Power Flip-Chip LEDs by Femtosecond Laser Direct Structuring
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DOI：
10.1109/jstqe.2009.2018132
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发表时间：
2009-05
影响因子：
4.9
通讯作者：
L. Kuna;A. Haase;F. Reil;C. Sommer;J. Krenn;P. Hartmann;P. Pachler;S. Tasch;F. Wenzl
中科院分区：
文献类型：
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作者：
L. Kuna;A. Haase;F. Reil;C. Sommer;J. Krenn;P. Hartmann;P. Pachler;S. Tasch;F. Wenzl
我们报告的飞秒激光直接结构的蓝宝石倒装表面的高功率倒装芯片LED。据发现，可以通过改变激光功率在一个恒定的激光脉冲数的亚微米大小的孔的直径和深度进行操纵。该方法能够以高精度控制结构尺寸。我们的研究表明，此类LED的光提取随着孔尺寸的增加而强烈增加。
We report on the femtosecond laser direct structuring of the sapphire flipside surfaces of high-power flip-chip LEDs. It is found that diameter and depth of the created submicrometer-sized holes can be manipulated by varying the laser power at a constant number of laser pulses. This method enables the control of the structure sizes with high precision. Our study shows that the light extraction from such LEDs increases strongly with increasing hole sizes.