Effect of processing routes on mechanical and thermal properties of copper-graphene composites
Effect of processing routes on mechanical and thermal properties of copper-graphene composites
复制标题
加工路线对铜-石墨烯复合材料机械和热性能的影响
DOI：
10.1080/02670836.2019.1646962
复制
发表时间：
2019-08-06
影响因子：
1.8
通讯作者：
Li, Hezhang
中科院分区：
文献类型：
--
作者：
Nazeer, Faisal;Ma, Zhuang;Li, Hezhang
本文采用球磨和超声两种不同的工艺路线制备了铜-石墨烯复合材料，并在此基础上进行了放电等离子烧结。测试了复合材料的维氏硬度和各向异性热导率，发现超声处理制备的复合材料的性能优于BM复合材料，甚至优于纯铜。通过仅使用0.5重量%的石墨烯，对于超声处理的铜-石墨烯复合材料获得的硬度值为69 HV（高57%）和热导率为387 W/m K（高13%），而对于纯铜，该值为44 HV和341 W/m K。超声处理后的复合材料的各向异性导热系数也达到了1.97，远高于纯铜的0.94。
In this paper, copper-graphene composites were fabricated by using two different processing routes (ball milling (BM) and ultrasonication) followed by spark plasma sintering. Vickers hardness and anisotropic thermal conductivity of the composites were measured and observed that ultrasonicated fabricated composites gave better result compared with BM composite and even from pure copper. The hardness values obtained for ultrasonicated copper-graphene composite were 69 HV (57% higher) and thermal conductivity 387 W/m K (13% higher) by using only 0.5 wt-% of graphene, while for pure copper the values were 44 HV and 341 W/m K. The value of anisotropic thermal conductivity ultrasonicated composites was also 1.97 which is much higher than pure copper 0.94.