Characteristics of a novel thermal-induced epoxy shape memory polymer for smart device applications
Characteristics of a novel thermal-induced epoxy shape memory polymer for smart device applications
复制标题
用于智能设备应用的新型热诱导环氧形状记忆聚合物的特性
DOI：
10.1088/2053-1591/ab6b5f
复制
发表时间：
2020-01-01
影响因子：
2.3
通讯作者：
Wang, Yongkun
中科院分区：
文献类型：
--
作者：
Cui, Hao;Tian, Wenchao;Wang, Yongkun
随着人们对电子技术应用需求的不断增加，智能材料的高性能化、多功能化和智能化控制已成为智能材料发展的主要趋势。本文开发了一种新型的热致环氧形状记忆聚合物（ESMP），并将其用作智能柔性电子器件的基片材料。由于热致ESMP的优点，电路基板可以在不同的工作温度下进行软硬可控。首先，制备了ESMP试样，并分别研究了其力学性能和形状记忆性能。其次，基于薄板挠度理论和有限元仿真软件，对工程应用中的受力行为进行了分析。同时，设计并进行了相应的实验测试，以验证理论和仿真结果。最后，设计并制作了基于ESMP的测试电路板。并对大变形下的电信号进行了测量，与典型电路板进行了比较。结果表明，所制备的ESMP作为一种智能材料，具有良好的可靠性和柔性，在智能器件领域具有很大的应用前景。
With the increasing demand for the application of electronic technology, high performance, multi-function and intelligent control have been the main developing trend of smart material. In this paper, a novel thermal-induced epoxy shape memory polymer (ESMP) is developed and utilized as substrate material for smart flexible electronic device. Owing to the advantage of thermal-induced ESMP, circuit substrate can be rigid-flexible controllable at different working temperature. Firstly, the ESMP samples are prepared and then the mechanical and shape memory characteristics are studied respectively. Secondly, the mechanical behaviors are analysed based on thin plate deflection theory and finite element simulation software on the engineering application. Meanwhile, corresponding experimental tests are designed and performed to corroborate the theory and simulation results. At last, ESMP based test circuit board is designed and manufactured. The electrical signals under large deformation are also measured and compared with typical circuit board. The results show that the prepared ESMP, as a smart material, has good reliability, flexibility and great application prospects in the field of intelligent devices.