Effect of thermal curing on the properties of thin films based on benzophenonetetracarboxylic dianhydride and 4,4′-diamino-3,3′-dimethyldiphenylmethane
Effect of thermal curing on the properties of thin films based on benzophenonetetracarboxylic dianhydride and 4,4′-diamino-3,3′-dimethyldiphenylmethane
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DOI：
10.1007/s10973-011-1345-8
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发表时间：
2011-02
影响因子：
4.4
通讯作者：
I. Sava;S. Chisca;M. Brumǎ;G. Lisa
中科院分区：
文献类型：
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作者：
I. Sava;S. Chisca;M. Brumǎ;G. Lisa
从聚酰胺酸溶液加工聚酰亚胺膜涉及溶剂的同时损失和化学转化，并且可能意味着结构重组，例如取向或结晶。研究了热处理对二苯甲酮四甲酸二酐和4，4 ′-二氨基-3，3 ′-二甲基二苯甲烷聚合物薄膜的热性能、力学性能和介电性能的影响。聚酰胺酸在不同温度下的热处理导致具有不同亚胺化程度的化合物;事实证明，亚胺化过程以高速进行，直到240 °C，然后保持恒定。动态力学分析（DMA）、接触角和介电性能测试表明，随着固化温度的升高，材料的储能模量和接触角增大，而介电常数减小。
The processing of polyimide films from polyamidic acid solutions involves the simultaeous loss of solvent and chemical conversion, and may imply structural reorganization such as orientation or crystallization. The effect of thermal treatment on the thermal, mechanical and dielectric properties of polymer films based on benzophenonetetracarboxylic dianhydride and 4,4’-diamino-3,3’-dimethyl diphenylmethane have been investigated. The thermal treatment of polyamidic acid at different temperatures led to compounds with different degree of imidization; it turned out that the imidization process took place with high speed until 240 °C and then remained constant. The dynamic mechanical analysis (DMA), contact angles, and dielectric measurements revealed that the storage modulus and contact angles increased with increasing of curing temperature while the dielectric constant decreased.