Heterojunctions fabricated by surface activated bonding?dependence of their nanostructural and electrical characteristics on thermal process
Heterojunctions fabricated by surface activated bonding?dependence of their nanostructural and electrical characteristics on thermal process
复制标题
通过表面活化键合制造的异质结？其纳米结构和电特性对热处理的依赖性
DOI：
10.35848/1347-4065/ac993f
复制
发表时间：
2022
影响因子：
1.5
通讯作者：
Ohno Yutaka
中科院分区：
文献类型：
--
作者：
Shigekawa Naoteru;Liang Jianbo;Ohno Yutaka
