Timing measurements with a 3D silicon sensor on Timepix3 in a 180 GeV/c hadron beam
Timing measurements with a 3D silicon sensor on Timepix3 in a 180 GeV/c hadron beam
复制标题
在 Timepix3 上使用 3D 硅传感器在 180 GeV/c 强子束中进行计时测量
DOI：
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发表时间：
2021
影响因子：
1.3
通讯作者：
H. Snoek
中科院分区：
文献类型：
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作者：
K. Heijhoff;K. Akiba;R. Bates;M. van Beuzekom;P. Bosch;A. Colijn;R. Geertsema;V. Gromov;M. Heidotting;L. Hendrikx;D. Hynds;H. Snoek
用Timepix3 ASIC上的三维传感器进行了测试光束测量，并给出了时间测量结果。测量结果与Timepix3上的薄平面传感器的测量结果进行了比较。结果表明，对于垂直入射光束，两个探测器的时间分辨率受Timepix3前端的支配。三维探测器以时间-数字转换为主导，而模拟前端抖动对薄平面探测器也有重要贡献。与薄平面探测器的683±8 ps相比，3D探测器的总时间分辨率为567±6 ps。然而，对于掠角光束，由于具有较低的像素电容，薄平面探测器获得了更好的时间分辨率，因此对于主要发生在此类测量中的低电荷信号，模拟前端的抖动较少。最后，还表明，通过结合多次单次命中测量，三维和薄平面探测器可以分别达到约100 ps和250 ps的大簇时间分辨率。
Test beam measurements have been carried out with a 3D sensor on a Timepix3 ASIC and the time measurements are presented. The measurements are compared to those of a thin planar sensor on Timepix3. It is shown that for a perpendicularly incident beam the time resolution of both detectors is dominated by the Timepix3 front-end. The 3D detector is dominated by the time-to-digital conversion whereas the analog front-end jitter also gives a significant contribution for the thin planar detector. The 3D detector reaches an overall time resolution of 567 ± 6 ps compared to 683 ± 8 ps for the thin planar detector. For a grazing angle beam, however, the thin planar detector achieves a better time resolution because it has a lower pixel capacitance, and therefore suffers less from jitter in the analog front-end for the low charge signals that mainly occur in this type of measurement. Finally, it is also shown that the 3D and thin planar detector can achieve time resolutions for large clusters of about 100 ps and 250 ps, respectively, by combining many single hit measurements.
LHCb VELO Timepix3 望远镜
影响因子：
1.3
作者：
Akiba K
通讯作者：
Akiba K
LHCb VELO Timepix3 望远镜的计时性能
影响因子：
1.3
作者：
Heijhoff K
通讯作者：
Heijhoff K