Enhanced adhesion of plasma-sputtered copper films on polyimide substrates by oxygen glow discharge for microelectronics
Enhanced adhesion of plasma-sputtered copper films on polyimide substrates by oxygen glow discharge for microelectronics
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DOI：
10.1016/j.tsf.2007.07.162
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发表时间：
2008-02-29
期刊：
影响因子：
2.1
通讯作者：
Liu, H. -M.
中科院分区：
文献类型：
--
作者：
Lin, Y. -S.;Liu, H. -M.
研究了氧辉光放电处理对聚酰亚胺基片上等离子体溅射铜膜附着力的增强作用。剥离测试证明了这种改进，在某些等离子体条件下，在未改性的聚酰亚胺基板上制备的铜膜的剥离强度为0.7-1.2 g/mm，在氧等离子体改性的聚酰亚胺基板上制备的铜膜的剥离强度为195.5-262.2 g/mm。氧等离子体溅射铜膜在聚酰亚胺基体上的附着强度的提高主要是由于聚酰亚胺基体表面能的增加。接触角的测量表明，聚酰亚胺基板的表面能大大增加了氧等离子体。X射线光电子能谱分析表明，使用氧等离子体的聚酰亚胺基板的表面能的增加发生，因为增加的氧表面浓度和增加的C-O键的比例。(c)2007 Elsevier B. V.保留所有权利。
Enhanced plasma-sputtered copper film adhesion onto polyimide substrates treated by oxygen glow discharge was investigated. The peel test demonstrates this improvement, with peel strengths of 0.7-1.2 g/mm for copper films prepared on un-modified polyimide substrates and 195.5-262.2 g/mm for copper films on oxygen plasma-modified polyimide substrates at certain plasma conditions. The enhanced adhesive strengths of plasma-sputtered copper films onto polyimide substrates by oxygen plasmas are due mainly to the increased surface energies of the polyimide substrates. Contact angle measurements indicate that the surface energies of polyimide substrates were greatly increased by oxygen plasmas. X-ray photoelectron spectroscopy analysis shows that the increased surface energies of polyimide substrates using oxygen plasmas occur because of the increased oxygen surface concentration and the increased C-O bond proportion. (c) 2007 Elsevier B.V. All rights reserved.