Composite lead-free electronic solders
Composite lead-free electronic solders
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DOI：
10.1007/s10854-006-9019-1
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发表时间：
2007-03-01
影响因子：
2.8
通讯作者：
Guo, Fu
中科院分区：
文献类型：
--
作者：
Guo, Fu
无铅焊料研究中已经开发了复合方法，以努力提高焊点的工作温度能力和热稳定性。本文概述了复合无铅焊料的发展背景、增强材料的作用及其要求、复合焊料加工技术以及复合焊料的研究现状。介绍了采用各种方法和增强类型生产的几种代表性无铅复合焊料的示例。分析了增强材料的添加对加工和力学性能的影响。提出复合焊料研究中存在的困难和问题，并以新兴的新型无铅复合焊料为例尝试解决方案。
Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.