Burn-in strategy based on Weibull failures
Burn-in strategy based on Weibull failures
复制标题
基于威布尔失效的老化策略
DOI：
10.1117/12.404872
复制
发表时间：
2000
影响因子：
7
通讯作者：
C. Huang
中科院分区：
文献类型：
--
作者：
W. Chien;C. Huang
老化对于IC，特别是DRAM来说至关重要。为了达到目标的故障率后，发布的产品给客户，制造商必须在组装和FT后的芯片老化一段时间，以淘汰薄弱的部分。重要的是确定老化时间，并建立一个再老化策略，以满足所需的故障率，并保持成本效益的同时。本文介绍了一种创新的方法来实现这两个目标，沿着一些实际问题的老化在现场应用。所提出的方法可以应用于通用的统计分布。在本报告中，所选的故障机制遵循威布尔分布来说明我们的方法。
Burn-in is crucial for ICs, especially for DRAM. To meet the target failure rate after releasing the products to customers, the manufacturers have to burn-in the chips after assembly and FT for a certain period of time to weed-out the weaker parts. It is important to determine the burn-in time and to set-up a re-burn-in strategy to meet required failure rate and to maintain cost-effective at the same time. This paper introduces an innovative approach to achieve these two objectives along with some practical concerns on burn-in at field applications. The proposed methodology can be applied on versatile statistical distributions. In this presentation, the selected failure mechanisms follows Weibull distribution to illustrate our approaches.