Micro-scale deformation measurement using the digital image correlation technique and scanning electron microscope imaging
Micro-scale deformation measurement using the digital image correlation technique and scanning electron microscope imaging
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DOI：
10.1243/03093247jsa412
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发表时间：
2008-08
期刊：
影响因子：
--
通讯作者：
H. Jin;W. Lu;J. Korellis
中科院分区：
文献类型：
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作者：
H. Jin;W. Lu;J. Korellis
本文利用扫描电子显微镜（SEM）图像和数字图像相关（DIC）技术研究了材料的微尺度变形。加载台被集成到扫描电镜成像系统中。在实验过程中，获得了一系列原位试样的扫描电镜图像。然后将DIC技术应用于这些SEM图像，以计算感兴趣区域的位移和应变场。为了获得DIC分析的有效模式，可能需要额外的表面制备。本文介绍了两种应用。使用小型拉伸试样，表征了电沉积镍基LIGA（来自德语单词光刻，电镀和成型的首字母缩写）试样的力学性能。在这种情况下，试样表面的自然微观结构特征被直接用作DIC分析的模式。该方法还应用于Al 6061-T651韧性断裂试验中裂纹尖端周围的应变集中研究。与前一种情况相反，DIC图案是通过铜网网格在试样表面溅射一层薄薄的金膜而产生的。
This paper presents a study of micro-scale deformation of materials utilizing scanning electron microscopy (SEM) images and the digital image correlation (DIC) technique. A loading stage was integrated into the SEM imaging system. During the experiment, a series of SEM images of the specimen were acquired in situ. The DIC technique was then applied to these SEM images to calculate the displacement and strain field at the area of interest. Additional surface preparation may be needed in order to have an effective pattern for DIC analysis. Two applications are presented in the paper. Using small tensile specimens, the mechanical properties of electrodeposited nickel-based LIGA (an acronym from German words for lithography, electroplating, and moulding) specimens were characterized. In this case, the natural microstructural feature of the specimen surface was used directly as the pattern for DIC analysis. This method was also applied to study the strain concentration around the crack tip during the ductile fracture test of Al 6061-T651. In contrast to the previous case, the DIC patterns were generated by sputtering a thin layer of gold film on to the specimen surface through the copper mesh grid.