Improvement of mechanical durability on organic TFT with printed electrodes prepared from nanoparticle ink

Improvement of mechanical durability on organic TFT with printed electrodes prepared from nanoparticle ink
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DOI:
10.1016/j.apsusc.2013.12.168
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发表时间:
2014-03
影响因子:
6.7
通讯作者:
Tomohito Sekine;H. Ikeda;Akifumi Kosakai;K. Fukuda;D. Kumaki;S. Tokito
Tomohito Sekine;H. Ikeda;Akifumi Kosakai;K. Fukuda;D. Kumaki;S. Tokito
中科院分区:
材料科学1区
文献类型:
--
作者:
Tomohito Sekine;H. Ikeda;Akifumi Kosakai;K. Fukuda;D. Kumaki;S. Tokito

文献摘要

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我们研究了一种机制,改善依赖于烧结温度的印刷银(Ag)电极制备的纳米粒子油墨上的绝缘聚合物层作为底层。通过在高于聚合物层的玻璃化转变温度(Tg)的温度下烧结Ag电极,粘合强度显著提高。在具有改进的导电性的样品中,在横截面扫描电子显微镜图像中观察到印刷的Ag电极和聚合物层之间的界面融合。基于这种机制,我们已经成功地证明了印刷银电极的有机薄膜晶体管(TFT)的机械耐久性的改善。施加弯曲应力后的有机TFT的退化显着抑制界面融合。
We investigated a mechanism of improving adhesiveness depending on sintering temperature for printed silver (Ag) electrodes prepared from nanoparticle ink on an insulating polymer layer as the under layer. The adhesion strength significantly improved by sintering the Ag electrodes at a temperature above the glass transition temperature (Tg) of the polymer layer. In the sample with improved adhesiveness, the interfacial fusion between the printed Ag electrodes and polymer layer was observed in a cross sectional scanning electron microscope image. Based on this mechanism, we have successfully demonstrated the improvement in mechanical durability of organic thin-film transistors (TFTs) with printed Ag electrodes. The degradation of the organic TFTs after applying bending stress was significantly suppressed by interfacial fusion.